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| 1 motorola sensor device data $"$ "##%" # " ! $ !"$%" ! #$ "$ the mpxv4006g series piezoresistive transducer is a stateoftheart monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with a/d inputs. this sensor combines a highly sensitive implanted strain gauge with advanced micromachining techniques, thinfilm metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. features ? temperature compensated over 10 to 60 c ? ideally suited for microprocessor or microcontroller based systems ? available in gauge surface mount (smt) or through hole (dip) configurations ? durable thermoplastic (pps) package figure 1. fully integrated pressure sensor schematic , ) ) %)!% # $ %* , ;?> % * !% !#$ * $' (*+( &$' %)*!&% % !% )* !% )* % (&+% ( ( % ) ! * !(+!*(/ '!%) % ( %& &%% *) &( )$## &+*#!% '" ,! replaces mpxt4006d/d order this document by mpxv4006g/d
semiconductor technical data ? motorola, inc. 2002
integrated pressure sensor 0 to 6 kpa (0 to 0.87 psi) 0.2 to 4.7 v output small outline package throughhole pin number 1 2 3 n/c v s gnd 5 6 7 n/c n/c n/c 4v out 8 n/c mpxv4006gc7u case 482c mpxv4006g7u case 482b note: pins 1, 5, 6, 7, and 8 are internal device connections. do not connect to external circuitry or ground. pin 1 is noted by the notch in the lead. mpxv4006g6u case 482 mpxv4006gc6u case 482a small outline package surface mount mpxv4006dp case 1351 mpxv4006gp case 1369 j rev 4 f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 2 motorola sensor device data maximum ratings (note) parametrics symbol value unit maximum pressure (p1 > p2) p max 24 kpa storage temperature t stg 30 to +100 c operating temperature t a +10 to +60 c note: exposure beyond the specified limits may cause permanent damage or degradation to the device. operating characteristics (v s = 5.0 vdc, t a = 25 c unless otherwise noted, p1 > p2. decoupling circuit shown in figure 3 required to meet electrical specifications.) characteristic symbol min typ max unit pressure range p op 0 e 6.0 kpa supply voltage (1) v s 4.75 5.0 5.25 vdc supply current i s e e 10 madc full scale span (2) (rl = 51k w ) v fss e 4.6 e v offset (3)(5) (rl = 51k w ) v off 0.100 0.225 0.430 v sensitivity v/p e 766 e mv/kpa accuracy (4)(5) (10 to 60 c) e e e 5.0 %v fss notes: 1. device is ratiometric within this specified excitation range. 2. full scale span (v fss ) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 3. offset (v off ) is defined as the output voltage at the minimum rated pressure. 4. accuracy (error budget) consists of the following: ? linearity: output deviation from a straight line relationship with pressure over the specified pressure range. ? temperature hysteresis: output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. ? pressure hysteresis: output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25 c. ? offset stability: output deviation, after 1000 temperature cycles, 30 to 100 c, and 1.5 million pressure cycles, with minimum rated pressure applied. ? tcspan: output deviation over the temperature range of 10 to 60 c, relative to 25 c. ? tcoffset: output deviation with minimum rated pressure applied, over the temperature range of 10 to 60 c, relative to 25 c. ? variation from nominal: the variation from nominal values, for offset or full scale span, as a percent of v fss , at 25 c. 5. auto zero at factory installation: due to the sensitivity of the mpxv4006g, external mechanical stresses and mounting positio n can affect the zero pressure output reading. to obtain the 5% fss accuracy, the device output must be aautozeroed'' after installation. autozeroing is defined as storing the zero pressure output reading and subtracting this from the device's output during normal operations. f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 3 motorola sensor device data onchip temperature compensation, calibration and signal conditioning the performance over temperature is achieved by inte- grating the shearstress strain gauge, temperature com- pensation, calibration and signal conditioning circuitry onto a single monolithic chip. figure 2 illustrates the gauge configuration in the basic chip carrier (case 482). a fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pres- sure signal to be transmitted to the silicon diaphragm. the mpxv4006g series sensor operating characteristics are based on use of dry air as pressure media. media, other than dry air, may have adverse ef fects on sensor performance and longterm reliability. internal reliability and qualification test for dry air, and other media, are available from the factory. contact the factory for information regarding media tolerance in your application. figure 3 shows the recommended decoupling circuit for in- terfacing the output of the integrated sensor to the a/d input of a microprocessor or microcontroller. proper decoupling of the power supply is recommended. figure 4 shows the sensor output signal relative to pres- sure input. typical, minimum and maximum output curves are shown for operation over a temperature range of 10 c to 60 c using the decoupling circuit shown in figure 3. the output will saturate outside of the specified pressure range. figure 2. crosssectional diagram (not to scale) figure 3. recommended power supply decoupling and output filtering recommendations. for additional output filtering, please refer to application note an1646. figure 4. output versus pressure differential $. ! ( %*!# '( ))+( 8'2 &+*'+*, *(%) ( +%*!&% , ;?> , ) 0 ' 1 , )) , ) , ,54 * $' >; $!% */'!# (see note 5 in operating characteristics) !') < &+*'+* ,= , % ,;?> #+&(&)!#!&% # ! &* -!( &% ! ( %*!# ) %)!% # $ %* * ($&'#)*! ) )*!%# )) )* # ' # ($ ' ' ! &% ! f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 4 motorola sensor device data pressure (p1)/vacuum (p2) side identification table motorola designates the two sides of the pressure sensor as the pressure (p1) side and the vacuum (p2) side. the pressure (p1) side is the side containing silicone gel which isolates the die from the environment. the motorola pres- sure sensor is designed to operate with positive differential pressure applied, p1 > p2. the pressure (p1) side may be identified by using the table below: part number case type pressure (p1) side identifier mpxv4006g6u/t1 482 stainless steel cap mpxv4006gc6u/t1 482a side with port attached mpxv4006g7u 482b stainless steel cap mpxv4006gc7u 482c side with port attached mpxv4006gp 1369 side with port attached mpxv4006dp 1351 side with part marking ordering information mpxv4006g series pressure sensors are available in the basic element package or with pressure ports. two packing options are offered for the 482 and 482a case configurations. device type options case no. mpx series order no. packing options marking basic element element only 482 mpxv4006g6u rails mpxv4006g element only 482 mpxv4006g6t1 tape and reel mpxv4006g element only 482 mpxv4006g7u rails mpxv4006g ported element axial port 482a mpxv4006gc6u rails mpxv4006g axial port 482a MPXV4006GC6T1 tape and reel mpxv4006g axial port 482a mpxv4006gc7u rails mpxv4006g side port 1369 mpxv4006gp trays mpxv4006g dual port 1351 mpxv4006dp trays mpxv4006g minimum recommended footprint for surface mounted applications surface mount board layout is a critical portion of the total design. the footprint for the surface mount packages must be the correct size to ensure proper solder connection inter- face between the board and the package. with the correct footprint, the packages will self align when subjected to a sol- der reflow process. it is always recommended to design boards with a solder mask layer to avoid bridging and short- ing between solder pads. */'. */'. */'. figure 5. sop footprint (case 482) 7:46 99 )# f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 5 motorola sensor device data small outline package dimensions surface mount case 48201 issue o ) ) %&* ) !$ %)!&%!% % *&# (%!% ' ( %)! / $ &%*(&##!% !$ %)!&% !% !$ %)!&% % & %&* !%#+ $&# '(&*(+)!&% $.!$+$ $&# '(&*(+)!&% ## , (*!# )+( ) */'!# ( * s d g 8 pl n ) $ ) * a b c m j k pin 1 identifier h t case 482a01 issue a ) ) %&* ) !$ %)!&%!% % *&# (%!% ' ( %)! / $ &%*(&##!% !$ %)!&% !% !$ %)!&% % & %&* !%#+ $&# '(&*(+)!&% $.!$+$ $&# '(&*(+)!&% ## , (*!# )+( ) */'!# ( * s d g 8 pl ) $ ) * a b c m j k pin 1 identifier h t n v w f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 6 motorola sensor device data small outline package dimensions continued surface mount case 136901 issue o d e e/2 n e $ a e1 a b c b detail g p %&* ) &%*(&##!% !$ %)!&% !% !%* ('( * !$ %)!&%) % *&# (% ) ' ( )$ / $ !$ %)!&%) % & %&* !%#+ $&# #) &( '(&*(+)!&%) $&# #) &( '(&*(+)!&%) ) ## %&* . ' ( )! !$ %)!&% 3 & ) %&* !%#+ $( '(&*(+)!&% ##&-# $( '(&*(+)!&% ) ## $.!$+$ ) ) f k m detail g l a1 q .014 (0.35) q t ? ) ) f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 7 motorola sensor device data small outline package dimensions continued surface mount case 135101 issue o d e e/2 n e $ a e1 a b c b detail g p %&* ) &%*(&##!% !$ %)!&% !% !%* ('( * !$ %)!&%) % *&# (% ) ' ( )$ / $ !$ %)!&%) % & %&* !%#+ $&# #) &( '(&*(+)!&%) $&# #) &( '(&*(+)!&%) ) ## %&* . ' ( )! !$ %)!&% 3 & ) %&* !%#+ $( '(&*(+)!&% ##&-# $( '(&*(+)!&% ) ## $.!$+$ ) ) f k m t ? detail g l a1 q .014 (0.35) q )*/# '!% % ,;?> ,= ,;?> % % % % )*/# '!% % ,= % ,;?> % % % % f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 8 motorola sensor device data small outline package dimensions continued throughhole case 482b03 issue b ) ) %&* ) !$ %)!&%!% % *&# (%!% ' ( %)! / $ &%*(&##!% !$ %)!&% !% !$ %)!&% % & %&* !%#+ $&# '(&*(+)!&% $.!$+$ $&# '(&*(+)!&% ## , (*!# )+( ) */'!# ( * !$ %)!&% ) *& %* ( & # - % &($ '(## # pin 1 identifier k t s g a b c m j n d 8 pl ) $ ) * detail x detail x case 482c03 issue b ) ) %&* ) !$ %)!&%!% % *&# (%!% ' ( %)! / $ &%*(&##!% !$ %)!&% !% !$ %)!&% % & %&* !%#+ $&# '(&*(+)!&% $.!$+$ $&# '(&*(+)!&% ## , (*!# )+( ) */'!# ( * !$ %)!&% ) *& %* ( & # - % &($ '(## # pin 1 k t s g a b c n v w m j identifier d 8 pl ) $ ) * detail x detail x f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 9 motorola sensor device data notes f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 10 motorola sensor device data notes f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 11 motorola sensor device data notes f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . 12 motorola sensor device data motorola reserves the right to make changes without further notice to any products herein. motorola makes no warranty, representation o r guarantee regarding the suitability of its products for any particular purpose, nor does motorola assume any liability arising out of the applicati on or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. atypicalo parameters can and do vary in dif ferent applications and actual performance may vary over time. all operating parameters, including atypicalso must be validated for e ach customer application by customer's technical experts. motorola does not convey any license under its patent rights nor the rights of others. motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications int ended to support or sustain life, or for any other application in which the failure of the motorola product could create a situation where personal injury or dea th may occur. should buyer purchase or use motorola products for any such unintended or unauthorized application, buyer shall indemnify and hold motorola and its o fficers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney f ees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleg es that motorola was negligent regarding the design or manufacture of the part. motorola and the stylized m logo are registered trademarks of motorola, inc. motorola, inc. is an equal opportunity/affirmative action employer. motorola and the stylized m logo are registered in the us patent & t rademark office. all other product or service names are the property of their respective owners. motorola, inc. 2002. how to reach us: usa/europe/locations not listed : motorola literature distribution; p.o. box 5405, denver, colorado 80217. 13036752140 or 18004412447 japan : motorola japan ltd.; sps, technical information center, 3201, minamiaz abu. minatoku, tokyo 1068573 japan. 8 1334403569 asia/pacific : motorola semiconductors h.k. ltd.; silicon harbour centre, 2 dai king street, tai po industrial estate, tai po, n.t., hong ko ng. 85226668334 technical information center: 18005216274 home page : http://www.motorola.com/semiconductors/ mpxv4006g/d ? f r e e s c a l e s e m i c o n d u c t o r , i freescale semiconductor, inc. f o r m o r e i n f o r m a t i o n o n t h i s p r o d u c t , g o t o : w w w . f r e e s c a l e . c o m n c . . . |
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